Mechanical Engineering ETDs

Publication Date

Spring 5-12-2026

Abstract

The enhanced geometrical design freedoms enabled by additive manufacturing (AM) are of particular interest in producing components for electrical and thermal applications. Copper (Cu) is an excellent conductor, but it is relatively unexplored in AM. For effective use in electrical and thermal assemblies, AM Cu requires further study. In the present work, the bulk and surface properties as well as the solderability of AM Cu produced by laser powder bed fusion (LPBF), directed energy deposition (DED), and bound powder extrusion (BPE) has been characterized. Additionally, the surface properties, effect of electroplating, and the solderability of AM 17-4 PH stainless steel are explored. LPBF Cu and nickel plated 17-4 PH wet very well with eutectic Tin-Lead (SnPb) solder, but BPE Cu was determined to have the best overall solderability. Surface modification by dry electropolishing is shown to decrease the surface roughness and improve solderability.

Keywords

Additive manufacturing, pure copper, surface modification, soldering, dry electropolishing, electroplating

Degree Name

Mechanical Engineering

Level of Degree

Masters

Department Name

Mechanical Engineering

First Committee Member (Chair)

Pankaj Kumar

Second Committee Member

Yu-Lin Shen

Third Committee Member

Benjamin White

Document Type

Thesis

Language

English

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Available for download on Tuesday, May 12, 2026

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