ENHANCEMENT OF SATURATION BOILING OF PF-5060 DIELECTRIC LIQUID ON MICROPOROUS SURFACES

Author

Ali Amir

Publication Date

2-13-2014

Abstract

This research experimentally investigated microporous Copper (MPC) surfaces for enhancing nucleate boiling and increasing the Critical Heat Flux (CHF) of PF-5060 dielectric liquid and the potential application of the results to immersion cooling of high power computer chips. MPC surfaces of different thicknesses (80—230 \uf06dm), fabricated using conventional electrochemical deposition at high current density, have different morphology and microstructure. The PF-5060 liquid is chemically inert, environmentally friendly, and has low enough saturation temperature (~ 54oC at 0.10 MPa). This helps maintain the chip junctions temperature below that recommended by the chip manufacturer (85-120 oC, depending on the application).'

Keywords

Boiling Enhancement, Two phase heat transfer, Microporous coating

Degree Name

Mechanical Engineering

Level of Degree

Doctoral

Department Name

Mechanical Engineering

First Committee Member (Chair)

Ward, Timothy

Second Committee Member

Heinrich, Juan

Third Committee Member

Leseman, Zayd

Document Type

Dissertation

Language

English

Recommended Citation

Amir, Ali. "ENHANCEMENT OF SATURATION BOILING OF PF-5060 DIELECTRIC LIQUID ON MICROPOROUS SURFACES." (2014). https://digitalrepository.unm.edu/me_etds/20