This paper will examine the effects of the introduction of a periodic boundary condition and the presence of underfill material on the stress and strain fields and evolution of failure of an FEA model that is representative of a solder joint in a 3D IC package. The model solder joint is placed between two silicon substrates in contact with through-silicon vias without any other devices or components attached. Differing solder joint thicknesses, both with and without underfill, will be examined to study the effect on the stress and strain fields as well as the evolution of failure in the solder joint. A dynamic loading on the FEA model will be used to examine the fracture pattern and mode of failure when the solder thickness is varied both with and without underfill material present.
Electronic packaging, Integrated circuits--Design and construction, Solder and soldering, Joints (Engineering), Metals--Fatigue.
Level of Degree
First Committee Member (Chair)
Second Committee Member
Flores, Geno. "Effects of underfill material on solder deformation and damage in 3D packages." (2013). http://digitalrepository.unm.edu/me_etds/73