Electrical and Computer Engineering ETDs

Publication Date



There has been a growing interest in using Infrared (IR) imaging systems in various applications ranging from medical diagnosis to military surveillance. The quality of the IR imaging systems depends on 1) the sensitivity of the Focal Plane Arrays (FPA) as the transducer of the electromagnetic wave and 2) the Readout Integrated Circuit (ROIC) that provides the pixel data to the processing unit. In this thesis, we describe specific ROIC designed for a dual-band IR imaging system. In particular, we focus on the ROIC part and propose an efficient circuit that meets several design objectives, including minimum power, minimum cost, and maximum dynamic range. We start with analog design of different parts of the circuit based upon a bottom-up design discipline. We then validate our design using TSpice simulation and analyzing the time/frequency response of the circuit at each step. Next, we proceed with layout design, where we present our final ROIC layout designed using Tanner EDA tools. Finally, we explain the ROIC test bed developed at the Center for High Technology Materials (CHTM), University of New Mexico, which can be used to test Indigo-based IR imaging systems as well as our designed ROIC.


Readout Integrated Circuit (ROIC), IR Imaging, Focal Plane Array (FPA), Integrate-While-Read and Integrate-Then-Read

Document Type




Degree Name

Electrical Engineering

Level of Degree


Department Name

Electrical and Computer Engineering

First Committee Member (Chair)

Zarkesh-Ha, Payman

Second Committee Member

Ghani, Nasir

Third Committee Member

Graham, Edward