
Electrical and Computer Engineering ETDs
Publication Date
5-20-1970
Abstract
For many industrial and analytical applications of thin films it is very essential to have a uniform thickness of the deposit. In response to this need, various techniques have been devised that are capable of providing the required uniformity on planar and slightly-curved spherical substrates. However, when a severe curvature (such as that encountered with some conical substrates) is introduced, the deposit uniformity that is obtainable with present techniques becomes quite poor. Thus, the need exists for new technology in this respect. Theoretical consideration is given to the problem of obtaining an ultra-uniform thin film coating on conical substrates. The problem study begins with an analysis of the dynamic processes involved with thermal evaporation, from which vapor-source characterization is made. Mathematical expressions are developed that generate the exact design parameters that yield highest uniformity when a new technique that is described is used. Experimental verification of the theory is presented. Application of the new deposition technique is made to a cursory investigation of the magnetic-flux shielding characteristics of a lead-coated conical substrate at liquid helium temperatures. Experimental evidence of flux-rejection is presented.
Document Type
Dissertation
Language
English
Degree Name
Electrical Engineering
Level of Degree
Doctoral
Department Name
Electrical and Computer Engineering
First Committee Member (Chair)
Wayne Willis Grannemann
Second Committee Member
Harold Dean Southward
Third Committee Member
William Jackson Byatt
Fourth Committee Member
James Vernon Lewis
Recommended Citation
Bechtel, Richard. "Vacuum Deposition of Thin Films of Ultra-High Thickness Uniformity on Conical Substrates Having Extreme Curvature." (1970). https://digitalrepository.unm.edu/ece_etds/671