Electrical and Computer Engineering ETDs

Publication Date

5-20-1970

Abstract

For many industrial and analytical applications of thin films it is very essential to have a uniform thickness of the deposit. In response to this need, various techniques have been devised that are capable of providing the required uniformity on planar and slightly-curved spherical substrates. However, when a severe curvature (such as that encountered with some conical substrates) is introduced, the deposit uniformity that is obtainable with present techniques becomes quite poor. Thus, the need exists for new technology in this respect. Theoretical consideration is given to the problem of obtaining an ultra-uniform thin film coating on conical substrates. The problem study begins with an analysis of the dynamic processes involved with thermal evaporation, from which vapor-source characterization is made. Mathematical expressions are developed that generate the exact design parameters that yield highest uniformity when a new technique that is described is used. Experimental verification of the theory is presented. Application of the new deposition technique is made to a cursory investigation of the magnetic-flux shielding characteristics of a lead-coated conical substrate at liquid helium temperatures. Experimental evidence of flux-rejection is presented.

Document Type

Dissertation

Language

English

Degree Name

Electrical Engineering

Level of Degree

Doctoral

Department Name

Electrical and Computer Engineering

First Committee Member (Chair)

Wayne Willis Grannemann

Second Committee Member

Harold Dean Southward

Third Committee Member

William Jackson Byatt

Fourth Committee Member

James Vernon Lewis

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